BERGQUIST GAP PAD TGP 3004SF is a high-performance, 3.0 W/m-K, thermally conductive gap filling material. 

BERGQUIST GAP PAD 3004SF is silicone-free by design and offers exceptionally low interfacial resistances 

to adjacent surfaces. It is designed for applications that are silicone-sensitive. 

BERGQUIST  TGP 3004SF is constructed using a 0.25-mils PET film that provides a no tack surface 

on one side and natural tack on the other side.

BERGQUIST GP3400SF Typical Applications Include:

1.Hard disk drives

2.HDD case to tray

3.HDD/SSD combination drives

4. Automotive electronics

5. Medical devices

6.Solar energy

7.Optical components

8.LED lighting

9. Laser optics

Configurations Available:

1. Sheet form and die-cut parts

2.Custom thicknesses available upon request