HPCM-1800P consists of a thermally conductive 55 ° C phase change compound coated ona thermally conductive polyimide film.

The polyimide reinforcement makes the material easy to handle and the 55°C phase change Temperature minimizes shipping and handling problems. 

HPCM-1800P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink.

Applications:

IGBT Module Heat Sink

Switching mode power supply

Power module

HPCM-1800P is the Thermally Conductive Phase Change Material,it can replace BERGQUIST HF300P,HI-FLOW THF 1600P